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QMTS2.E124294
Polymeric Materials - Filament-wound Tubing, Industrial Laminates, Vulcanized Fiber, and Materials for Use in Fabricating Recognized Printed Wiring Boards - Component

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Polymeric Materials - Filament-wound Tubing, Industrial Laminates, Vulcanized Fiber, and Materials for Use in Fabricating Recognized Printed Wiring Boards - Component


See General Information for Polymeric Materials - Filament-wound Tubing, Industrial Laminates, Vulcanized Fiber, and Materials for Use in Fabricating Recognized Printed Wiring Boards - Component

E I DUPONT DE NEMOURS & CO INCE124294
DUPONT ELECTRONICS
FLEX CIRCUITS MATERIALS
14 T W ALEXANDER DR
RESEARCH TRIANGLE PK, NC 27709 USA

Films:

Build up R.T.I. H

Mtl
Dsg
ANSI
Type

Color		 Min
Thk
(mm)
Flame
Class
Elec
(°C)
Mech
(°C)		 H
W
I		 H
A
I		 V
T
R		 C
T
I		 Meets
746E
DSR

Polyimide (PI) Films, furnished as sheets.
AC No ANSI NC 0.0125 V-0 240 240 0 4 - - -
0.025 V-0 240 240 - 4 - 3 -

Metal base industrial laminates:

Metal Dielectric R.T.I. H

Mtl
Dsg

Color		 Min
Thk
(mm)		 Max
Thk
(mm)		 Min
Thk
(mic)		 Max
Thk
(mic)
Flame
Class
Elec
(°C)
Mech
(°C)		 H
W
I		 H
A
I		 V
T
R		 C
T
I		 Meets
746E
DSR

Aluminum base with Polyimide (PI) dielectric, industrial laminates, furnished as sheets.
CooLam LX NC 0.15 2.0 17 25 V-0 130 130 - 0 - 2 -

Base films (declad materials):

Film Adhesive R.T.I. H

Mtl
Dsg

Color		 Min
Thk
(mm)		 Max
Thk
(mm)		 Min
Thk
(mic)		 Max
Thk
(mic)
Flame
Class
Elec
(°C)
Mech
(°C)		 H
W
I		 H
A
I		 V
T
R		 C
T
I		 Meets
746E
DSR

Polyimide (PI) Base films with flame retardant acrylic adhesive on one or both sides, furnished as sheets or rolls.
Pyralux FR#@
NC 0.0127 - 10.2 - VTM-0 240 200 2 2 2 3 Yes
NC - 0.127 - 102 VTM-0 240 200 0 0 3 3 Yes

Polyimide (PI) Base films with Polyimide (PI) adhesive on one or both sides, furnished as sheets or rolls.
CooLam LAF #@
NC 0.013 0.025 - - V-0 130 130 0 4 - - -
Interra HK041818@, Interra HK041836@, Interra HK041872 (4)@
NC 0.018 0.018 - - V-0 130 130 - - - - -
Interra HK042518@, Interra HK042536@, Interra HK042572(4)@
NC 0.025 0.025 - - V-0 240 200 0 4 - 4 -
Interra HK04J#@ (4)
NC 0.013 0.025 - - V-0 130 130 0 4 4 3 -
Pyralux AL#@
NC 0.025 0.025 - - V-0 240 200 0 4 - 4 -
Pyralux AP#@
NC 0.013 0.025 - - V-0 130 130 0 4 - - -
NC 0.050 0.152 - - V-0 240 200 0 3 4 4 Yes
Pyralux APR#%
NC 0.013 0.025 - - V-0 130 130 0 4 - - -
NC 0.05 0.152 - - V-0 240 200 0 3 4 4 Yes
Pyralux AX181818@, Pyralux AX121812@
NC 0.018 0.018 - - V-0 - - - - - - -
Pyralux AX182518@
NC 0.025 0.025 - - V-0 240 200 0 4 - 4 -
Pyralux AX352535@
NC 0.025 0.025 - - V-0 240 200 0 4 - 4 -

Polyimide (PI) Base films with adhesive on one or both sides, furnished as sheets.
Pyralux AC
NC 0.012 - - - V-0 240 240 0 4 - - -
NC 0.025 - - - V-0 240 240 - 4 - 3 -

Metal clad films:

Film Adhesive Clad Cond Thk Max Max Solder Lts
Metal
Clad
Dsg		 Lam-
inate
Dsg		 Pre-
preg
Dsg		 Min
Thk
(mm)		 Max
Thk
(mm)		 Min
Thk
(mic)		 Max
Thk
(mic)		 Min
Ext
(mic)		 Max
Ext
(mic)		 Max
Int
(mic)		 Area
Dia
(mm)
Flame
Class		 Oper
Temp
(°C)
Temp
(°C)
Time
(sec)

Polyimide (PI) with flame retardant acrylic adhesive Metal clad films for use in single layer printed wiring boards with copper on one or both sides, furnished as sheets or rolls.
Pyralux FR#@
Pyralux FR# - 0.0127 0.127 10.2 102 17.5 140 - 50.8 VTM-0 105 288 10

Polyimide (PI) with Polyimide (PI) adhesive Metal clad films for use in single layer printed wiring boards with copper on one or both sides, furnished as sheets or rolls.
CooLam LAF#@
CooLam LAF #@ - 0.013 0.025 - - 9 102 - 50.8 V-0 130 288 60
Interra HK042518@, Interra HK042536@, Interra HK042572@(4)
Interra HK042518@, Interra HK042536@, Interra HK042572(4)@ - 0.025 0.025 - - 17.5 102 - 50.8 V-0 180 288 10
Pyralux AL#@(1)
- - 0.025 0.025 - - 17.5 102 - 50.8 V-0 180 288 10
Pyralux AL#@(2)
Pyralux AL#@ - 0.025 0.025 - - 17.5 102 - 50.8 V-0 105 288 10
Pyralux AP#@(1)
Pyralux AP#@ - 0.013 0.025 - - 9 102 - 50.8 V-0 130 288 60
0.050 0.152 - - 9 102 - 50.8 V-0 180 288 60
Pyralux AP#@(2)
Pyralux AP#@ - 0.013 0.025 - - 9 102 - 50.8 V-0 105 288 10
0.050 0.127 - - 9 102 - 50.8 V-0 105 288 10
Pyralux APR#%
Pyralux APR#% - 0.013 0.025 - - 9 102 - 50.8 V-0 130 288 60
0.05 0.152 - - 9 102 - 50.8 V-0 180 288 60
Pyralux AX182518@(1), Pyralux AX352535@(1)
Pyralux AX182518@ - 0.025 0.025 - - 17.5 102 - 50.8 V-0 165 288 10

Polyimide (PI) with adhesive Metal clad films for use in single layer printed wiring boards with copper on one or both sides, furnished as sheets.
DNC DNC - 0.0125 - - - 18 70 - 50.8 V-0 105 280 10
FNC FNC - 0.0125 - - - 17 68 - 25.4 V-0 105 260 10

Polyimide (PI) with adhesive Metal clad films for use in single layer printed wiring boards with copper on one or both sides, furnished as sheets or rolls.
Pyralux AC@
Pyralux AC@ - 0.012 0.045 - - 17 35 - 50.8 V-0 155 288 10

Metal clad films for use in single layer printed wiring boards with copper on one or both sides.
Interra HK04J #@(4)
Interra HK04J (4) - 0.013 0.025 - - 9 102 - 50.8 V-0 130 288 60

Metal clad metal base industrial laminates:

Metal Dielectric Clad Cond Thk Max Max Solder Lts
Metal
Clad
Dsg		 Lam-
inate
Dsg		 Pre-
preg
Dsg		 Min
Thk
(mm)		 Max
Thk
(mm)		 Min
Thk
(mic)		 Max
Thk
(mic)		 Min
Ext
(mic)		 Max
Ext
(mic)		 Max
Int
(mic)		 Area
Dia
(mm)
Flame
Class		 Oper
Temp
(°C)
Temp
(°C)
Time
(sec)

Aluminum base with Polyimide (PI) dielectric, Metal clad industrial laminates with copper on one side only, furnished as sheets.
CooLam LX
CooLam LX - 0.15 2.0 17 25 35 140 - 50.8 V-0 130 350 60

Metal clad films (Flammability Only Recognition):

Film Adhesive Clad Cond Thk Max Max Solder Lts
Metal
Clad
Dsg		 Lam-
inate
Dsg		 Pre-
preg
Dsg		 Min
Thk
(mm)		 Max
Thk
(mm)		 Min
Thk
(mic)		 Max
Thk
(mic)		 Min
Ext
(mic)		 Max
Ext
(mic)		 Max
Int
(mic)		 Area
Dia
(mm)
Flame
Class		 Oper
Temp
(°C)
Temp
(°C)
Time
(sec)

Polyimide (PI) with adhesive Metal clad films for use in single layer printed wiring boards with copper on one or both sides, furnished as sheets or rolls (Flammability Only Recognition).
Rexonad
- - 0.05 - - - - - - - V-0 - - -

Bonding film unsupported (Freefilms):

Mtl
Dsg
Color		 Min Thk
(mic)		 Max Thk
(mic)		 Flame
Class

Bonding film unsupported (Freefilms) for use in printed wiring boards, furnished as rolls.
Pyralux FR0100(3) NC 25 - -
Pyralux FR0200 NC 51 - VTM-0
Pyralux FR0300 NC 76 - VTM-0
Pyralux FR1500(3) NC 12.5 - -
Pyralux FRA# NC 51 - VTM-0
76 - VTM-0
Pyralux LF0100 NC 25 - -
Pyralux LF0200 NC 51 - -
Pyralux LF0300 NC 76 - -
Pyralux LF1500 NC 12.5 - -

Coverlays:

Film Adhesive
Mtl
Dsg
Color		 Min Thk
(mm)		 Max Thk
(mm)		 Min Thk
(mic)		 Max Thk
(mic)		 Flame
Class

Polyimide (PI) film Coverlays for use in flexible printed wiring boards.
DNCC NC 0.0125 - - - V-0
FNCC NC 0.0125 - - - V-0
Pyralux FR NC 0.0125 0.125 12.5 76.2 VTM-0
Pyralux HF (AA)
NC 0.0125 - - - V-0

Bonding film supported (Bondplys):

Film Adhesive
Mtl
Dsg
Color		 Min Thk
(mm)		 Max Thk
(mm)		 Min Thk
(mic)		 Max Thk
(mic)		 Flame
Class

Perfluoroalkoxy film with acrylic adhesive Bonding film supported (Bondplys) for use in flexible printed wiring boards.
Pyralux FT NC 0.051 0.254 12.5 51 V-0

Polyimide (PI) film Bonding film supported (Bondplys) for use in flexible printed wiring boards, furnished as sheets.
Pyralux FR NC 0.0125 0.125 12.5 76.2 VTM-0

Investigated flex package combinations:

Film Adhesive Copper

Category
Grade		 Min Thk
(mm)		 Max Thk
(mm)		 Min Thk
(mic)		 Max Thk
(mic)		 Min Thk
(mic)		 Max Thk
(mic)
Pyralux AL#@(2) Flame Class: V-0; Max Area Diam (mm): 50.8; Max Oper Temp (°C): 105; Solder Limits (C/sec): 288/10
Unclad film Pyralux AL$@(2) 0.025 0.025 - - 17.5 70
Coverlay Pyralux FR# 0.025 0.125 10.2 75 - -
Pyralux AP#@(2) Flame Class: V-0; Max Area Diam (mm): 50.8; Max Oper Temp (°C): 105; Solder Limits (C/sec): 288/10
Unclad film Pyralux AP#@(2) 0.050 0.152 - - 9 70
Coverlay Pyralux FR# 0.025 0.125 10.2 75 - -
Pyralux FR#@ Flame Class: VTM-0; Max Area Diam (mm): 50.8; Max Oper Temp (°C): 105; Solder Limits (C/sec): 288/10
Unclad film Pyralux FR#@ 0.0125 0.125 10.2 75 18 70
Coverlay Pyralux FR# 0.025 0.125 10.2 75 - -

# - Represents 3-9 alphanumerics.

% - Represents one or two letters to identify resistive foil type.

(1) - Without coverlay.

(2) - With coverlay DuPont Pyralux FR.

(3) - May be used with FR at the same thickness limitations as FR.

(4) - May be intermixed with UL/ANSI FR-4 laminates.

(AA) - 1- Cover film Pyralux® HF is Recognized at a thickness range of 12.5-25 microns, in combination with Dupont (E124924) Pyralux Source Material AX182518@,AX352535@ at a limited thickness of 25 microns with limited copper thickness of 18 microns or with Dupont (E124924) Pyralux Source Material AC@ at a limited thickness range of 12 - 45 microns with copper thickness range of 18-35 microns.

@ - Represents one or two letter to identify copper type


Marking: Company name or tradename "Dupont Electronics" , "Interra" or trademark and material designation on container or wrapper.
Last Updated on 2009-10-16

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